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COMe Ref.Carrier T6
COM Express® Reference Carrier Type 6
- COM Express® Rev. 2.0, Pin-out Typ 6
- Mini-ITX-Formfaktor (170mm x 170mm)
- DVI-I, Displayport, HDMI, LVDS
- SIM-Karten-Unterstützung, Smart Battery, USB 3.0
- Compliance:
- COM Express® Rev. 2.0
- Pin-out Typ 6
- Abmessungen: 170 x 170 mm (Mini-ITX)
- Unterstützte Module: COM Express® Basic oder Compact mit Pin-out Typ 6
- Graphics:
- 1x LVDS / JILI FFC 40-Anschluss
- 1x DVI-I (VGA, DDI1)
- 1x DP ++ (DDI2)
- 1x HDMI (DDI3)
- Festplatten:
- 3x SATA
- 1x eSATA
- USB:
- 2x USB 3.0
- 4x USB 2.0
- PCI Express/PCI-Support:
- 1x PCI Express x4
- 1x miniPCIe (mit USB-und SIM-Karte)
- 1x Expresscard (mit USB)
- Audio:
- Realtek ALC886 HD-Audio
- S / PDIF-in / out, Toslink
- 5.1 Audio-Buchsen
- Front Panel Audioanschluss
- Ethernet: 1x 10/100/1000 Mbit RJ 45-Anschluss
- Serial: 2x UART auf Stiftleiste (aus Modul)
- Special Features:
- SIM-Karte
- 1x PWM Fan
- SPI Boot
- Gemeinsame Ausstattung:
- Feature Connector
- Port80 POST Code Display
- Diagnose-LED
- PWR / RST Tasten
- Optionen:
- Carrier EEPROM
- Kompatibilität zu Type 10 Modulen
- Stromversorgung:
- ATX Netzteil 20+8-Pin
- 8,5 - 20V Single Supply Support
- 2x 10.8V Smart Battery Support
- Temperatur:
- Betrieb: 0° bis 60°C
- Lagerung: -30° bis 85°C
- Luftfeuchtigkeit: 93% relative Luftfeuchtigkeit bei 40 ° C, nicht kondensierend (gemäß IEC 60068-2-78)
Kontron is a global leader in embedded computing technology and a sought-after consultant for the realization of business models and applications tailored to the Internet of Things. Thanks to its extensive portfolio of hardware, software and service solutions, Kontron achieves the optimum for the respective customer applications. This allows them to focus fully on their core competencies.
Kontron and its R&D staff are developing many of the standards that are driving the world of embedded computing platforms forward. These pioneering technologies and applications not only enable new business models, but also change and enrich the lives of millions of people. The result is faster time-to-market, lower total cost of ownership, long-term availability, and holistically optimized applications based on leading, highly reliable embedded technology.
