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COMe-bTL6 (E2)
COM Express Basic Type 6 with 11th Gen. Intel® Core/Xeon processors
The COM Express® COMe bTL6-H (Tiger Lake-H) CPUs are featuring up to 8 cores and are specifically suited for demanding Edge workloads and high-end, high-bandwidth applications. Intel® Iris® XeGraphics supports up to four independent 4K displays or one 8K HDR display. AI-workloads in machine vision or medical applications reach new levels of performance with the GPU and Intel® Deep Learning Boost. Integrated TSN- and Intel® TCC-functionality enable deterministic networks in Industry 4.0 as well as various real-time applications.
The TDP of the processor chips ranges from 25 to 45 watts, with eight processing cores enabling clock frequencies of up to 5.0 GHz. A maximum of three DDR4 SO-DIMM sockets allow a memory expansion of up to 96 GBytes (non-ECC/ECC). With integrated Intel® UHD graphics supporting up to four independent 4K displays, up to 40 HD video streams can be processed and analyzed in parallel at 1080p/30fps resolution. In addition, fast 2.5 GBit Ethernet with Time Sensitive Networking (TSN) and Intel® Time Coordinated Computing (Intel® TCC) predestines the module for demanding real-time applications.
As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally used, which enables highly effective data processing even under harsh conditions. The COMe-bTL6 (E2) module guarantees full computing power even in extreme industrial environments with temperatures ranging from -40 °C to +85 °C and offers a higher number of application-ready integrated features and more powerful cooling compared to alternative smaller form factor designs.
- Compliance: COM Express® basic, Pin-out Type 6
- Dimensions: 125 x 95 mm
- CPU: Intel® 11th Generation CoreTM / Xeon® family
- Chipset: HM570E, QM580E and RM590E
- Main Memory: 2x DDR4 SODIMM dual channel up to 64 GByte ECC or non ECC (optional 3rd SODIMM socket for 96 GByte)
- Graphics Controller: Intel® Iris®Xe Graphics on i7/i5 processors Intel® xxx Graphics on i3/Xeon® processors
- Ethernet Controller: Intel® I225LM/I225IT
- Ethernet: Up to 2.5Gb Ethernet with TSN & WOL support (depending on SKU)
- Storage: 4x SATA 6Gb/s
- Flash Onboard: Up to 1 TByte NVMe SSD (on request)
- PCI Express: 8x PCIe 3.0 (8GT/s), Default configuration 8x1, optional 1x4 + 4x1, 2x4 etc. 1x16 PCIe 4.0 on PEG Lanes #0-3
- Display: DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit
- USB: 4x USB 3.2; 8x USB 2.0
- Serial: 2x serial interface (RX/TX only)
- Audio: High Definition Audio interface
- Special Features:
- Trusted Platform Module TPM 2.0
- (G)SPI, LPC, SMB, Fast I2C, Staged Watchdog, RTC, support of Intel® OptaneTM memory technology via PCIe
- Power Management: ACPI 6.0
- Power Supply: 8.5 V – 20 V Wide Range, Single Supply Power
- BIOS: AMI UEFI
- Operating System: Windows® 10, Linux, VxWorks
- Temperature:
- Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
- Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating
- Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
Kontron is a global leader in embedded computing technology and a sought-after consultant for the realization of business models and applications tailored to the Internet of Things. Thanks to its extensive portfolio of hardware, software and service solutions, Kontron achieves the optimum for the respective customer applications. This allows them to focus fully on their core competencies.
Kontron and its R&D staff are developing many of the standards that are driving the world of embedded computing platforms forward. These pioneering technologies and applications not only enable new business models, but also change and enrich the lives of millions of people. The result is faster time-to-market, lower total cost of ownership, long-term availability, and holistically optimized applications based on leading, highly reliable embedded technology.
