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High-voltage IGBT modules (HVIGBT) are essential components in power electronics applications, especially where high voltages and currents need to be controlled. These modules cover a wide range of reverse voltages from 1700 to 6500 volts and offer rated currents between 200 and 2400 amperes, depending on the version. Particularly noteworthy is the X series, which includes half-bridge modules with reverse voltages of up to 6500 volts and currents of up to 1200 amps. These modules use the latest 7th generation IGBT chips, which are housed in a compact 100 x 140 x 40 mm housing with an aluminum baseplate.
The design of the high-voltage IGBT modules is characterized by maximum reliability and robustness. Optimized materials and manufacturing processes ensure improved current exchange capability, which significantly increases the longevity and load capacity of the modules. This is complemented by the strictest quality controls, which include both static and dynamic switching tests to ensure consistently high performance.
A special feature of the 1.7 kV HVIGBT modules is the use of Light Punch Through Carrier Stored Trench Gate Bipolar Transistor (ÖPT-CSTBT™) technology in combination with a new freewheeling diode design. This combination enables significantly reduced IGBT switching losses and minimizes diode oscillations at the same time - a clear advantage for efficient and low-noise operation in demanding applications. HVIGBT and HVDIODE modules are therefore perfectly matched and offer a flexible solution for multilevel inverters and other high-voltage applications.