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The X-Series offers half-bridge modules up to 6500 V as well as 1200 A with 7th generation IGBT chips in an aluminum baseplate package measuring only 100 x 140 x 40 mm, the LV100 or HV100.
The LV100 series is now also available for industrial applications. In these modules, the manufacturer Mitsubishi has already connected power semiconductor chips in parallel in the module. A low-inductance symmetrical design in the module ensures a uniform utilization of the semiconductor chips. The connections of the modules are designed in such a way that they are optimally suited for parallel connection of the modules. Here, too, the design promotes a symmetrical structure. Thus nothing stands in the way of an increase in performance.
The available blocking voltages (e.g. 2kV) of the modules also allow 2-level technology, where in the past 3-levels were often required. This also simplifies the overall design.