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COMe-mEL10(E2)

COM Express Mini Type 10 with Intel Atom X6000E, PENTIUM and Celeron Series

The COMe-mEL10 (E2) is a credit card sized Computer-on-Modules platform based on the Intel® Atom® x6000 Series, Pentium® and Celeron® processors.

The COMe-mEL10 (E2) performance range of COM Express mini modules is highly scalable and covers the entire range of Intel's latest IoT-ready embedded processors. This includes the Intel Atom x6000 series, as well as Intel Pentium and Intel Celeron processor. LPDDR4-4267 up to 16GB is offered, In-Band ECC support depends on the processor capability.

The modules combine state-of-the-art image processing and graphics capabilities with extensive real-time computing power in an energy-efficient and standardized Type 10 Computer-on-Module mini form factor. Users benefit from a significantly improved computing performance, an impressive performance-per-watt ratio and the long-term availability inherent in all Kontron embedded solutions.

The COMe-mEL10 (E2) comes with support for Windows 10, Linux and VxWorks 7.x

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  • COM Express® mini, Pin-out Type 10
  • Dimension (H x W): 84 x 55 mm
  • CPU COMe-mEL10:
    • Intel® Celeron® J6413, 4C, 1.8/3.0GHz, 16EU, 10W
    • Intel® Pentium® J6426, 4C, 2.0/3.0GHz, 32EU, 10W
    • Intel® Celeron® N6211, 2C, 1.2/3.0GHz, 16EU, 6.5W
    • Intel® Pentium® N6415, 4C, 1.2/3.0GHz, 16EU, 6.5W
    • CPU COMe-mEL10 E2:
    • Intel® Atom® x6211E, 2C, 1.3/3.0GHz, 16EU, 6W
    • Intel® Atom® x6413E, 4C, 1.5/3.0GHz, 16EU, 9W
    • Intel® Atom® x6425E, 4C, 2.0/3.0GHz, 32EU, 12W
    • Intel® Atom® x6212RE, 2C, 1.2GHz/-, 16EU, 6W
    • Intel® Atom® x6414RE, 4C, 1.5GHz/-, 16EU, 9W
    • Intel® Atom® x6425RE, 4C, 1.9GHz/-, 32EU, 12W
  • Chipset: Integrated in SoC
  • Main Memory: Up to 16 GByte LPDDR4-4267 memory down (In-Band ECC)
  • Graphics Controller: Intel® HD Gfx Gen11: LVDS/eDP, 1x DP++, up to 4K
  • Ethernet Controller: SOC + LAN PHY GPY115 (GPY215 on request)
  • Ethernet: 1GBit Ethernet with GPY115 (2.5GBit on request with GPY215)
  • Storage: 2x SATA 6 Gb/s
  • Flash Onboard: Up to 64 GB eMMC pSLC / 128 GB MLC (build option)
  • PCI Express: PCIe Gen 3.0 - PCIe lane configurations: 4 x1, 2 x1 + 1 x2, 2 x2
  • Display: DDI: DP++, LVDS: Single Channel 18/24 bit or eDP 1.3
  • USB: 2x USB 3.1 (incl. USB 2.0) + 6x USB 2.0, Port 7 is dual role (Client/Host)
  • Serial: 2x serial interface (RX / TX only)
  • Audio: Intel® High Definition Audio
  • Common Features: SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC
  • Special Features: Industrial grade temperature
  • Options: 
    • eMMC Flash configuration (up to 64 GByte pSLC, up to 128 GByte MLC),
    • eDP instead of LVDS,
    • General Purpose SPI instead of Boot SPI, USB client, Seoarate TPM 2.0 chip, de-populated LAN PHY
  • Power Management: ACPI 6.0
  • Power Supply: 4.75V - 20V Wide Range, Single Supply Power
  • BIOS: AMI Aptio V
  • Operating System: Windows® 10, Linux, VxWorks
  • Temperature:
    • COMe-mEL10- commercial temperature: 0° C to +60° C operating, -30° C to +85° C non-operating
    • COMe-mEL10 E2 - industrial temperature: -40° C to +85° C operating, -40° C to +85° C non-operating

Kontron is a global leader in embedded computing technology and a sought-after consultant for the realization of business models and applications tailored to the Internet of Things. Thanks to its extensive portfolio of hardware, software and service solutions, Kontron achieves the optimum for the respective customer applications. This allows them to focus fully on their core competencies.

Kontron and its R&D staff are developing many of the standards that are driving the world of embedded computing platforms forward. These pioneering technologies and applications not only enable new business models, but also change and enrich the lives of millions of people. The result is faster time-to-market, lower total cost of ownership, long-term availability, and holistically optimized applications based on leading, highly reliable embedded technology.

Product variants:

  • COMe-mEL10 E2 x6212RE
    • CPU x6212RE 
    • Memory 4 GByte, 3200 MT/s 
    • ETH PHY 1 GbE 
    • Flash eMMC 16 GByte MLC 
    • LPC, LVDS 
    • Op. Temp. -40 °C - 85 °C
  • COMe-mEL10 E2 x6212RE
    • CPU x6212RE
    • Memory 4 GByte, 3200 MT/s 
    • ETH PHY 1 GbE 
    • Flash eMMC 32 GByte MLC 
    • LPC, LVDS 
    • Op. Temp. -40 °C - 85 °C
  • COMe-mEL10 E2 x6212RE
    • CPU x6212RE
    • Memory 8 GByte, 4267 MT/s 
    • ETH PHY 1 GbE 
    • Flash eMMC 32 GByte MLC 
    • LPC, LVDS 
    • Op. Temp. -40 °C - 85 °C
  • COMe-mEL10 N6211
    • CPU N6211 
    • Memory 4 GByte, 3200 MT/s 
    • ETH PHY 1 GbE 
    • Flash eMMC 16 GByte MLC 
    • LPC, LVDS 
    • Op. Temp. 0 °C - 60 °C
  • COMe-mEL10 J6426
    • CPU J6426 
    • Memory 4 GByte, 3733 MT/s 
    • ETH PHY 1 GbE 
    • Flash eMMC 32 GByte MLC 
    • LPC, LVDS 
    • Op. Temp. 0 °C - 60 °C

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