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SiWx917

Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 SoCs

The SiWx917 SoC is one of the lowest power Wi-Fi 6 SoC, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWx917 SoC includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 7x7 mm QFN package. The wireless subsystem consists of a multi-threaded processor (ThreadArch®) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4F running up to 180 MHz, embedded SRAM, FLASH, AI/ML accelerator and enhanced security engine designed for PSA-L2. The ARM® Cortex®-M4F is dedicated for peripheral and application-related processing, while the ThreadArch® runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications.

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HY-LINE Technology GmbH
+49 89 614 503 10sales@hy-line.de
  • Ultra-Low Power Wireless System on a Chip
    • Wi-Fi 6 Single band 2.4 GHz and Bluetooth Low Energy 5.4 wireless radio
    • ARM® Cortex®-M4F Application MCU up to 180 MHz
    • Integrated baseband processor, RF transceiver, high-power amplifier, balun and T/R switch
    • Integrated AI/ML accelerator using matrix vector processor (MVP)
    • Embedded SRAM up to 672 KB
    • Embedded Flash up to 8 MB and supports opt external Flash
    • Embedded pSRAM up to 8 MB and supports Opt external pSRAM
    • Integrated Wi-Fi stack, TCP/IP stack, Bluetooth stack supporting wireless coexistence and Matter
  • Wi-Fi 6
    • Compliant to to 2.4 GHz, single-spatial stream IEEE 802.11 b/g/n/ax
    • Supports 802.11ax 20 MHz features such as OFDMA, MU-MIMO, and Target Wake Time (TWT)
    • Transmit power up to +21 dBm with integrated PA
    • Receive sensitivity as low as -98.5 dBm
    • Data Rates: up to 86 Mbps (802.11ax MCS0 to MCS7)
    • Operating frequency range: 2412 MHz - 2484 MHz
  • Bluetooth Low Energy 5.4
    • Transmit power up to +21 dBm with integrated PA
    • Receive sensitivity: LE: -95 dBm, LR 125 Kbps: -106 dBm
    • Operating frequency range: 2402 MHz - 2480 MHz
    • Bluetooth Low Energy 1 Mbps, 2 Mbps and Long-Range modes (125 kbps, 500 kbps)
  • Microcontroller Subsystem
    • ARM® Cortex®-M4F core with up to 180 MHz
    • Integrated FPU, MPU, and NVIC
    • In-System Programming (ISP) and Over-the-Air (OTA) wireless firmware update
    • Power-On Reset (POR), Brown/Black-out and Black-out Detection
    • Rich set of Analog and Digital Peripherals
    • Digital Peripherals - SDIO, 1x USART, 2x UART, 4x SPI, 3x I2C, 2x I2S, SIO, PWM, QEI
    • Timers: 4x 16/32-bit, 1x 24-bit, WDT, RTC
    • Up to 46 GPIOs (GPIO Multiplexer)
    • Analog Peripherals - 12-bit 16-ch, 5 Msps ADC, 10-bit DAC
    • 3x Op-amps 2x Comparators, IR detector and Temp Sensor, 8 capacitive touch sensor inputs
  • Best-in-Class Security
    • Security engine designed for PSA-L2
    • QSPI Secure XIP from Flash (w/ AES-XTS)
    • Secure Zone, Separated TEE
    • TRNG, Root of trust (PUF)
    • Secure Boot & OTA
    • Advanced Cryptographic Accelerators
  • Ultra-Low System Power Consumption
    • Wi-Fi Standby Associated mode current: 51 μA @ 1-second interval
    • Deep sleep current < 1 μA, Sleep/Standby current (RAM retention) < 10 μA
    • Low MCU Sub-system active current: 19 μA/MHz in LP mode
  • Matter
    • Matter over Wi-Fi with Bluetooth LE commissioning
  • Software and Protocol Support
    • Integrated Wi-Fi stack, TCP/IP stack, Bluetooth stack supporting wireless coexistence
    • Support for Embedded Client mode, Access Point mode (up to 8 clients), Concurrent Wi-Fi and Bluetooth LE mode
    • Supports advanced Wi-Fi and Networking security features: WPA/WPA2/WPA3-Personal and Enterprise security
    • Integrated TCP/IP stack supports HTTP/HTTPS, DHCP, SSL/TLS1.3, MQTT
    • Wireless firmware upgrade and provisioning
    • Supports both hosted (Radio Co-Processor (RCP), and Network Co-processor (NCP) modes and host-less (SoC) modes
  • Operating Conditions
    • Wide operating supply range: 1.75 V to 3.63 V
    • Operating temperature: -40°C to +85/105°C  
  • Package Size
    • QMS: 7.00 mm x 7.00 mm x 0.85 mm
  • Development Environment
    • Simplicity Studio v5, GitHub
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SDIO Module / Matter

The manufacturer Silicon Labs from Austin / Texas, specialized in Bluetooth, Bluetooth Smart and Wifi technologies, offers an extensive family of various Bluetooth, Bluetooth Smart and Wifi modules for use in industry, medicine, telemetry, telematics, M2M and mobile systems.

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+49 89 614 503 10
sales@hy-line.de