BGM240P | HY-LINE

Search website:

Related links

Wishlist

Your wishlist is empty

ProductsWireless modules and semiconductorsBluetooth+BGM240P

Based on the EFR32BG24 Series 2 SoC, it enables Bluetooth Low Energy connectivity, exceptional RF performance and energy efficiency, industry-leading Secure Vault technology and future-proof features.
The BGM240P is a complete solution with robust and fully upgradeable software stacks, worldwide regulatory certifications.

Do you have questions about our products?

Please let us know.

HY-LINE Technology GmbH

+49 89 614 503 10 sales@hy-line.de

Bluetooth Low Energy 5.3 and Bluetooth Mesh connectivity
Built-in antenna or RF pin
+10 or +20 dBm TX output power
-98.5 dBm RX sensitivity
32-bit ARM® Cortex® M33 core at 39 MHz
1536/256 kB Flash/RAM memory
Vault High or Vault Mid security
Extensive analogue and digital peripherals
26 GPIO connections

Kategorie wählen::

Bluetooth 5

bgm240p-datasheet.pdf

The manufacturer Silicon Labs from Austin / Texas, specialized in Bluetooth, Bluetooth Smart and Wifi technologies, offers an extensive family of various Bluetooth, Bluetooth Smart and Wifi modules for use in industry, medicine, telemetry, telematics, M2M and mobile systems.

Our products fit into the most diverse fields of application. If there is no suitable product for you, please ask us, we will also be able to offer you an ideal solution for your field of application.

Si117x Biometric

Biometric Optical Sensor

Si7006/13/20/21/34

Relative Humidity and Temperature Sensor with I2C Interface

Proximity and Ambient Light Sensor IC with I2C Interface

Digital Temperature Sensors with I2C Interface

Hall Effect Magnetic Sensor

Bluetooth Dual Mode v. 4.2

BT122 Development Kit

Kit for evaluating BT122 dual-mode Bluetooth module

Bluetooth Low Energy Modules

The World’s Smallest Bluetooth SiP Module

The World’s Smallest Bluetooth SiP Module

WLAN-Module, 2.4GHz, CAN, I2C, I2S, SPI, UART, USB, Internet of Things (IoT)

Bluetooth Mesh Module

Universal module with up to 8dBm transmit power

Ultra-Small System-In-Package for Bluetooth 5 LE and Bluetooth Mesh Connectivity

BT 5 high power

EFR32BG12P432xx

Bluetooth SoC with max.10 dBm transmit power

EFR32BG12P433xx

Bluetooth SoC with max.19 dBm transmit power and Sub-GHz

EFR32BG13P732xx

Bluetooth SoC with max. 19 dBm Sendeleistung

EFR32BG13P733xx

Multi-Protokoll SoC with max. 19 dBm Sendeleistung

SoC of Series 2 with Ultra Low Power for IoT solutions

Blue Gecko Starter Kit

UG144: EFR32BG1 2.4 GHz 10.5 dBm Radio Board

RF transceiver, 2.412GHz-2.484GHz, 72.2MB/s, 16.4dBm output, -91.7dBm input, 1.8V-3.3V, QFN-32

Wifi-Transceiver-Module, 2.412-2.484GHZ

Development Kit, WGM160P WiFi-Modul, ETH-Erweiterungsmöglichkeit

Fully Integrated Z-WAVE Wireless System-In-Package

Fully Integrated Z-WAVE Wireless Module

Mighty Gecko Starter Kit

UG262: EFR32MG12 2400/868 MHz 10 dBm Radio Board

Mighty Gecko SoC with Integrated Serial Flash Data Sheet

Module for Zigbee and Thread

Module for Bluetooth, Zigbee and Thread

Not Recommended for New Design

Mighty Gecko Mesh Networking Module Data Sheet

Mighty Gecko Multi-Protocol Wireless Mesh Module Data Sheet

Expansion board, wireless module, BGM111 SoC, +8dBm, for Blue Gecko starter kits

Expansion board, wireless module, BGM113 SoC, +3dBm, for Blue Gecko starter kits

Radio board, Blue Gecko Bluetooth® SiP module, +8dBm output power, BLE applications

Wireless Radio Board, Blue Gecko Bluetooth SiP Module, +8dBm Output Power

Blue Gecko Starter Kit BLE BGM113 2.4GHZ

Funkplatine, EFR32™ Blue Gecko, Bluetooth® Low Energy, 2,4GHz, +10dBm

Radio board, EFR32BG13 Blue Gecko, Bluetooth® Low Energy, +10dBm output power

Development-Kit für BGM210P und MGM210P

Wireless-Starter-Kit, Bluetooth-System-In Package-Modul, für BGM121, BGM123 und BGM111

Fast, low-power 8-bit solutions featuring fully-integrated analog functionality and peripherals

Flex Gecko Proprietary Protocol SoC Family

Wireless-Starter-Kit, EFR32 Flex Gecko 2400/868MHz-Wireless-SoC, boardinternal J-Link-Debugger

EZRadioPRO ISM Band Transmitters, Receivers and Transceivers

Expansion board, wireless module, BGM13P22 SoC, +8dBm, for Blue Gecko starter kits

Development board, Wireless-Xpress starter kit, BGX13P Bluetooth module, Serial-to-USB bridge

ystem in Package Module Series 2

System in Package Module Series 2

BG22 Bluetooth Module Explorer Kit

BG22 Bluetooth Module Explorer Kit

EFR32BG24 Series 2 Wireless SoC

Bluetooth 5.3 / Mesh SoC

EFM32™ 32-bit

Based on ARM® Cortex® -M0+, Cortex-M3 and Cortex-M4 cores, energy-friendly peripherals

Multiprotocol Module - Matter Ready

Sub-GHz Wireless + 2.4 GHz BLE SoCs

Wi-Fi 6 plus Bluetooth Low Energy 5.4 Wireless SoCs

Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 SoCs

Wi-Fi Transceiver Modules

Wi-Fi Transceiver Modules

EFR32BG26 Series 2 Wireless SoC

Bluetooth 5.4 / Mesh SoC

EFR32MG26 Series 2 Multiprotocol Wireless SoC

BLE 5.3 / Mesh / Matter / Zigbee

Find out more about our products: latest news, whitepapers, brochures and videos from HY-LINE.

30.01.2019 | Video

Angle of Arrival - Bluetooth 5.1 Direction Finding Explanation

14.11.2016 | Video

BGM121/123 Hardware Design Guidelines

31.01.2022 | Newsletter

Webinar-Reihe: Wireless Connectivity Tech Talks

04.07.2023 | Newsletter

Virtual Conference „Works With 2023“ von Silicon Labs – Jetzt anmelden

18.12.2023 | Press

Kompakte Multiprotokoll-Konnektivität für IoT-Anwendungen Wireless Design-In

24.01.2024 | Press

Drahtlos-Konnektivität und Prozessor in einem SoC Wireless Design-In

31.05.2021

Bluetooth Mesh and Message Relay

31.05.2021

Developing for Bluetooth Mesh

31.05.2021

Bluetooth Mesh in Action

28.04.2022 | Newsletter

Bluetooth Classic-Module End-of-Life

08.02.2023 | Newsletter

Bluetooth Classic-Module End-of-Life - Alternativen

Search

Contact

+49 89 614 503 10

sales@hy-line.de

Additional Info