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BGM220S

System in Package Module Series 2

BGM220SC22HNA EFR32BG22 Series 2 wireless modules include a 76.8 ARM Cortex-M33 core, providing plenty of processing capability, while integrated security features provide fast encryption, secure boot loading and a debug access control. Certified worldwide and supported by robust, industry-proven software and advanced development tools, BGM220SC22HNA is a complete solution to quickly add Bluetooth connectivity to any IoT design. This module includes 512 kB of flash, 32 kB of RAM, and is available in a 6.0x6.0x1.1, SIP package. 

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HY-LINE Technology GmbH
+49 89 614 503 10sales@hy-line.de
  • MCU Core / Frequency (MHz): ARM-Cortex M33 / 76.8
  • RX Sensitivity (dBm): -98.9
  • TX Power (dBm): -27 to 6
  • RAM / Flash (kB): 32 / 512
  • Bluetooth 5 LE Long Range: No
  • Bluetooth 5 – 2M PHY: Yes
  • Bluetooth 5.2 / 5.1: Yes
  • Antenna: Built-in and RF PIN
  • Dig I/o PINS: 25
  • RF Shield: Yes
  • Temperature (°C): -40 to 105
  • Package (mm): 6.0x6.0x1.1

 

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Bluetooth 5

The manufacturer Silicon Labs from Austin / Texas, specialized in Bluetooth, Bluetooth Smart and Wifi technologies, offers an extensive family of various Bluetooth, Bluetooth Smart and Wifi modules for use in industry, medicine, telemetry, telematics, M2M and mobile systems.

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+49 89 614 503 10
sales@hy-line.de