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2SP0430T2B0C-FF1800R17IP5

Dual-Channel SCALE-2 Plug&Play Driver for 1200 V and 1700 V PrimePACK 3+ IGBT Modules

The plug-and-play 2SP0430 gate driver family is optimized for operation of 1200 V and 1700 V PrimePACK™ 3+ IGBT power modules in 2-level and 3-level applications. The gate driver features an electrical interface with 15 V logic and built-in DC/DC power supply. Power Integrations' Dynamic Advanced Active Clamping allows an extended DC-link voltage range in IGBT off-state for up to 60 s in PV and regenerating applications (e.g. traction).

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  • Ready-to-use date driver solution for PrimePACK 3+ IGBT power modules with 1200 V and 1700 V blocking voltage
  • Dual channel gate driver
  • Electrical primary-side interface with reinforced insolation
  • Available for 2-level and 3-level applications
  • ±30 A peak output gate current
  • 2 W output power per channel at maximum ambient temperature
  • -40 ºC to +85 ºC operating ambient temperature
IGBT Hersteller:
Infineon
Unterstützte Module:
FF1800R17IP5
Modulgehäuse:
PrimePACK™ 3+
Ansteuerung:
Direct-Independent
Interface-Typ:
Electrical
Gate-Strom:
+30 A
Ausgangsleistg./ Kanal:
2.0 W
Sperrspannung (max):
1700 V
Versorgungsspg.:
15 V
Max. Schaltfreq.:
10.0 kHz
Temperaturbereich:
-40 ℃ ... 85 ℃
Schutzfunktionen:
Dynamic Adv Active Clamping, Over-voltage, Short Circuit, UVLO(Sec-side), UVLO(Pri-side)
Delay time:
Rise: - Fall:
Isolation Type:
Reinforced isolation according to IEC 60664-1
Conformal Coating:
Ja
UL:
UL compliant

Power Integrations offers highly integrated IGBT drivers. Based on decades of experience, ASICs have been developed for the driver and monitoring functions, which together with the inductive transformers form the core of the drivers. Extensive application design support is offered.

Highly integrated driver components: cheaper than discrete in-house development

MOSFETs and IGBTs are convenient to drive with low power, unlike bipolar power semiconductors. However, high gate capacitances must be recharged and, in the case of stacked IGBTs for HVDC (high-voltage DC transmission), large potential differences must also be bridged. In addition, there are protection functions for the power semiconductors and a negative bias voltage for IGBTs to be blocked so that they cannot switch through and fail as a result of transients in bridge circuits.

In view of the high voltages, some know-how is required here. For example, special regulations on insulation clearances, clearances and creepage distances, and partial discharge resistance must be observed, and these must also be checked with expensive measuring equipment. Likewise, the degradation of the board substrate and the migration of metal ions in it must be taken into account, which can otherwise lead to premature short circuits and total failures.

Instead of launching costly in-house developments, it makes sense here to use proven, safe driver modules designed using in-house developed, monolithic highly integrated semiconductor components as well as proprietary planar transformers, such as those offered by Power Integrations under the name SCALE (which stands for Scaleable, Compact, All-purpose, Low-cost and Easy-to-use). Power Integrations, previously CONCEPT, has been developing IGBT driver solutions for over 30 years and therefore has unrivaled experience with this topic.

The SCALE devices are driven with standard logic levels from 3.3 to 15 V and are very economical in the IGBT field: they are cheaper and more reliable than conventional discrete circuit designs, especially when it comes to driving high-voltage IGBTs. Thus HY-LINE Power Components offers you everything around inverters and high performance DC/DC converters from one source.

Power Integrations offers both general modules, the SCALE Driver Cores, and modules adapted to specific IGBT modules, the SCALE Plug-and-Play Drivers. In addition, there are the monolithically integrated SCALE iDriver chips.

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