Super Mini Full SiC DIPIPM

ProductsActive and passive componentsSemiconductorSiC Switches+Super Mini Full SiC DIPIPM

Full SIC DIP is an ultra-small compact transfer molded intelligent power module integrating SiC MOSFET chip which is the next generation high efficiency power chips. Power chips, drive and protection circuits are integrated in the module with transfer molding resin.

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HY-LINE Technology GmbH

+49 89 614 503 10 sales@hy-line.de

Integrated newly developed SiC MOSFET for improving efficiency
No requirement of negative bias by mounting MOSFET with high threshold voltage VGSth.
Single DC 18V power supply drive with bootstrappingscheme.
Safety operating SiC MOSFET by protection functions.
Easy to replace from conventional V.6 due to pin and function compatibility.

full_sic_dipipm.pdf

Mitsubishi Electric is the technology leader in the field of IGBT modules - now in their 7th generation - and Intelligent Power Modules (IPM). The compact design offers significant advantages, especially for harsh environmental conditions such as in drive technology.

Our products fit into the most diverse fields of application. If there is no suitable product for you, please ask us, we will also be able to offer you an ideal solution for your field of application.